Avionics
- mechanical design
- shock & vibe
- thermal design
- EMI/RFI packaging
- component engineering
- documentation
Product Spotlight
KOR Electronics, Inc. needed temporary mechanical engineering support when multiple DRFMs had to be designed in parallel.
Piton provided this support, designing a complete mechanical system that met the environmental conditions of a jet based test instrument.
The instrument was designed with tight size and shape constraints; high altitude and high/low temperature requirements; and shock and vibration performance requirements.
An RF/digital/power backplane interconnect system was devised to allow high density packaging of various electronic modules. This was possible through the use of coax loaded card-edge connectors. Each of four RF modules was designed to plug into the unit for ease of assembly and maintenance.
A forced air cooling system was specified to work with the natural airflow in the instrument test pod and to maintain acceptable component temperatures at high temp, and low pressure. In addition, a resistance heating element was incorporated for the high altitude, low temp, test flight environment. Internal ribs supported a three piece sheetmetal skin, providing a rugged housing.