Southern California based company specializing in the electronic design and mechanical packaging of electronic products for the telecommunications, RF wireless, medical, professional audio, computer and consumer products industries.   Electronic Product Design
Piton Engineering provides new product and subsystem development, electrical engineering, mechanical engineering, cost reduction redesign, industrial design, test set design and fabrication, reverse engineering and documentation, 3-D modeling and 2-D design and drafting, schematic capture and pcb layout, vendor sourcing and interface, rapid prototyping management, and prototype assembly and test. Home Portfolio Services Contact us
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Ortel Corporation, Inc., a world-wide supplier of high performance lasers and photodetectors, needed expertise it did not have in-house: system chassis design

Fiber Optic Link
level electronic packaging. Ortel turned to Piton to provide this expertise and the result is the company's flagship product, the "System 8000 Fiber Optic Link".

Piton provided mechanical engineering from concept through documentation for this modular, customer configured system. The two main mechanical systems were the chassis and the fiberoptic xmtr/rcvr "plug-in" module. For the chassis, an exhaustive search of 19" sub-rack vendors was conducted and a customized version of an Elma enclosure was chosen. This allowed use of off-the-shelf extrusions, and cardguides, but with modified sheetmetal covers.

A thermal analysis, assuming the worst case configuration of a full capacity Ku-Band transmitter system, dictated a dual fan cooling system. Air intake vents were located on the bottom cover and side panels.

For ease of assembly and replacement, redundant dual power supplies were designed as plug-ins that could slide in from the front of the product. These modules engaged chassis-mounted Type H DIN 41612 connectors which were wired into a backplane circuit board. Vicor power modules were analyzed and free convection finned heatsinks were specified for the two DC-DC versions.

A universal plug-in design was created that would meet the requirements of IF-Band, L-Band, C-Band, and Ku-Band transmitters and receivers. Based on a single piece of sheetmetal, this design allowed slide-in module connection to a DC/signal backplane, RF connection to blind-mate SMA connectors, and fiberoptic FC/APC adapter interface to the rear panel. Each module integrated an EMI/RFI housing, (appropriate for it's frequency) with an analog circuit board and a cooling system.
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